Parts Procurement
Related articles
NTC Thermistor MF53-103F-3977-500L
APPLICATIONS Suitable for surface sensing applications, especially when a good electrical insulation and a good thermal contact with the chassis is required. DESCRIPTION A NTC thermistor chip is solde...
Various brand of electronic components procurement from XZH
XZH Technology Co., Ltd was found in 2014. The company is strong and professional technical, with a perfect quality assurance ...
Ic Chip Module Sim800C GPRS Module
FAQ:What is your MOQ?No MOQ.What about package? Generally, we pack our goods in neutral white boxes and brown cartons. If you have legally registered patent, we can pack the goods in your br...
What brand of components are available in XZH
Brand of components: TI, ST, ON, Wurth, ADM, Vishay, NXP, Microchip, AVX, Kemet, Panasonic, TE. JAE, HRS,Molex, ect.YAGEO, MURATA, TDK, Samsung, NDK, KDS, WALSIN, TAICON, HOLY STONE, TAIYO, ...
HPMA115SO-XXX specification
DESCRIPTION The Honeywell HPM Series Particulate Matter Sensor is a laser-based sensor which detects and counts particles using light scattering. The detection concentration range is...
Different chip packaging
DIP: Commonly used in the cache and early memory chips of Intel cpus.PGA: Commonly used in wireless network, medical devices, and circuits.PLCC: Commonly used in automotive electronics, computer, moni...
Leave a comment
![访客](https://xzhems.com/zb_users/avatar/0.png)