Parts Procurement
DIP: Commonly used in the cache and early memory chips of Intel cpus.
PGA: Commonly used in wireless network, medICal devices, and circuits.
PLCC: Commonly used in automotive electronics, computer, monitoring, aerospace medical, etc.
LGA: Commonly used in the packaging of microprocessors and other high-end chips, Intel CPU and other high-end products.
BGA: Commonly used in computer motherboards, tablet computers, automotive engines, security equipment aerospace and so on.
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