Parts Procurement
DIP: Commonly used in the cache and early memory chips of Intel cpus.
PGA: Commonly used in wireless network, medICal devices, and circuits.
PLCC: Commonly used in automotive electronics, computer, monitoring, aerospace medical, etc.
LGA: Commonly used in the packaging of microprocessors and other high-end chips, Intel CPU and other high-end products.
BGA: Commonly used in computer motherboards, tablet computers, automotive engines, security equipment aerospace and so on.
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What brand of components are available in XZH
Brand of components: TI, ST, ON, Wurth, ADM, Vishay, NXP, Microchip, AVX, Kemet, Panasonic, TE. JAE, HRS，Molex, ect.YAGEO, MURATA, TDK, Samsung, NDK, KDS, WALSIN, TAICON, HOLY STONE, TAIYO, ...
NTC Thermistor MF53-103F-3977-500L
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Original and new components procurement from XZH
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Diffenrent types of sensors procurement
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HPMA115SO-XXX specification
DESCRIPTION The Honeywell HPM Series Particulate Matter Sensor is a laser-based sensor which detects and counts particles using light scattering. The detection concentration range is...
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