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Different chip packaging

    XZH Technology Co., Ltd was found in 2014. The company is strong and professional technical, with a perfect quality assurance system and advanced test-analyzed instruments.
Preferential for large quantities

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DIP: Commonly used in the cache and early memory chips of Intel cpus.

PGA: Commonly used in wireless network, medICal devices, and circuits.

PLCC: Commonly used in automotive electronics, computer, monitoring, aerospace medical, etc.

LGA: Commonly used in the packaging of microprocessors and other high-end chips, Intel CPU and other high-end products.

BGA: Commonly used in computer motherboards, tablet computers, automotive engines, security equipment aerospace and so on.

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